DS Selected for 2025 Super-Gap Startup 1000+ Project (Semiconductor Sector)

High-performance advanced packaging, the core of the next-generation semiconductor market, and DS, the guardian protecting its precise world, is receiving national attention. By proudly being listed in the system semiconductor sector of the...

Apr 22, 2025 - 00:00
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High-performance advanced packaging, the core of the next-generation semiconductor market, and DS, the guardian protecting its precise world, is receiving national attention. By proudly being listed in the system semiconductor sector of the Korea Institute of Startup & Entrepreneurship Development's '2025 Supergap Startup 1000+ Project', it has once again highlighted the importance of defect detection technology amid the surging demand for HBM semiconductors. DS's proprietary core technology, 'DeepSeers', captures images in real-time using 2D and 3D optical systems, then analyzes them at high speed with deep learning to accurately identify defects. In particular, its 3D technology, which measures even minute wafer warpage and gaps, is an indispensable element in the latest advanced packaging processes. DeepSeers goes beyond simply detecting defects; it clearly classifies initially detected defects into 'true defects' and 'false defects', offering a differentiated solution that innovatively boosts the yield of OSAT (Outsourced Semiconductor Assembly and Test) companies. This is regarded as original technology applicable to mass production equipment immediately after high-speed imaging. DeepSeers, which debuted in September 2024, was successfully supplied to five domestic and international companies immediately upon its launch, and for 2025, it has already secured over 10 new contracts, demonstrating a strong market response. In fact, its revenue in the first quarter of this year already surpassed its entire 2024 revenue of 500 million won, indicating explosive growth. Not stopping there, DS is partnering with multiple large language model (LLM) development startups to lead the convergence of AI and semiconductor technology. Using this Supergap Project as a stepping stone, and considering the characteristics of mass production lines that require strict security, DS plans to introduce an innovative system that detects defects interactively within the equipment without external connections. Since its establishment in May 2021, DS has been recognized for its unparalleled technological capabilities in HBM semiconductor defect detection. In July 2024, it was the only Korean company selected as an 'Innovation Company' at the Nanning International Talent Innovation Competition in China, and numerous achievements, such as winning the Grand Prize at the 2024 Incheon Creative Economy Innovation Center Youth Startup Challenge and being selected as a D.Camp batch company by the Banks Foundation for Young Entrepreneurs, attest to this. Han Ki-joon, CEO of DS, expressed his strong ambition, stating, "As a startup leading the convergence of recently highlighted advanced packaging technology and AI technology, we will expand our market and achieve sustainable growth based on our differentiated technological capabilities and the precision of our solutions." DS is garnering expectations as a key player that will open up the future of the advanced semiconductor package defect detection market.

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